SAWSTREET LLC
ORLANDO, FL 32819-6508
SDVOSB Certified
Visibility Score
35
Capabilities Narrative
SawStreet provides backend services that include Grinding, Polishing, Dicing, Pick & Place, and Inspection. SawStreet handless low to mid volume, specializing in quick turn requirements. Additional services include managing IC packaging and bumping
NAICS Codes
| Code | Description | Primary |
|---|---|---|
| 334413 | Semiconductor and Related Device Manufacturing |
Keywords
Wafer Processing, Wafer Dicing, Pick and Place, Dicing Wafers, Quick Turn, Wafer Grinding, Die Pick and Place, Backend Services, GaAs Wafer Process, Reticle Dicing, Quick Turn Process, Si Wafer Processing, Wafer Thinning, Die Inspection
Contact Information
Business Details
- UEI
- J1E6NRGLUBD5
- CAGE Code
- 5B9L4
- Year Established
- 2008
- Legal Structure
- LLC
- Congressional District
- 10