GRINDING & DICING SERVICES, INC.
SAN JOSE, CA 95133-1002
Visibility Score
25
Capabilities Narrative
GDSI provides wafer grinding and dicing to large and small integrated circuit manufacturers as well as fabless companies. GDSIs service offerings include backgrinding, dicing and saw, pick and place, automated inspection, and wafer polishing.
NAICS Codes
| Code | Description | Primary |
|---|---|---|
| 334413 | Semiconductor and Related Device Manufacturing |
Keywords
Grinding, dicing, semiconductortapes
Contact Information
Business Details
- UEI
- JB1LXJ2E3HV9
- CAGE Code
- 3FEJ2
- Year Established
- 1992
- Legal Structure
- Corporation
- Congressional District
- 17